説明
Describes an experiment on CSP joining reliability with Sn-Zn-Bi paste and Sn-Ag-Cu/Sn-Pb balls by heat-exposure and mechanical tests. Reflow was carried out at 210, 220 and 230/spl deg/C in air. The height of the ball array has a key role in the reliability. Aging at 125/spl deg/C did not show any serious degradation.
収録刊行物
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- Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing
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Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing 1059-1063, 2002-11-14
IEEE Comput. Soc