- 【Updated on May 12, 2025】 Integration of CiNii Dissertations and CiNii Books into CiNii Research
- Trial version of CiNii Research Knowledge Graph Search feature is available on CiNii Labs
- Suspension and deletion of data provided by Nikkei BP
- Regarding the recording of “Research Data” and “Evidence Data”
Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder
Description
<jats:p>The erosion behavior of plasma nitriding SUS304 stainless steel by molten lead-free solder was examined. Plasma nitriding treatment was conducted to the surface of SUS304 steel. The thickness of the nitriding layer was approximately 17 μm. The layer mainly consists of Fe4N, CrN and Cr2N. Erosion of nitriding SUS304 stainless steel was observed after erosion test with molten Sn-3Ag-0.5Cu (mass%) solder at 450°C for 100 h. On the basis of the result of microstructure observation, it was found that Sn diffusion into the nitrided layer occurred in non eroded area. The result shows that Sn diffusion into the nitrided layer induces erosion of plasma nitriding stainless steel.</jats:p>
Journal
-
- ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
-
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 673-676, 2011-01-01
ASMEDC
