Reduction of Contact Resistance between Na<sub><i>x</i></sub>CoO<sub>2</sub> Thermoelectric Chip and Ag Electrode by Using Spark Plasma Sintering Method.

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<jats:title>ABSTRACT</jats:title><jats:p>Na<jats:sub><jats:italic>x</jats:italic></jats:sub>CoO<jats:sub>2</jats:sub> has a particularly high contact resistance because it forms an insulated layer of NaHCO<jats:sub>3</jats:sub> and Na<jats:sub>2</jats:sub>CO<jats:sub>3</jats:sub>, which are produced in a chemical reaction with carbon dioxide and water in air on the surface. In this study, we tried to improve the interface resistance between Na<jats:sub><jats:italic>x</jats:italic></jats:sub>CoO<jats:sub>2</jats:sub> and Ag sheet electrodes by connecting these materials with the spark plasma sintering (SPS) technique. The interface resistance between Na<jats:sub><jats:italic>x</jats:italic></jats:sub>CoO<jats:sub>2</jats:sub> and Ag sheet electrodes connected by SPS is compared with that connected with Ag paste. In an experiment, the interface resistance of a sample treated by decrease to less than 1/600 of the former value. It is thought that the NaHCO<jats:sub>3</jats:sub> and Na<jats:sub>2</jats:sub>CO<jats:sub>3</jats:sub> insulated layer is decomposed through the application of a large value of applied DC current by using the SPS technique.</jats:p>

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  • MRS Proceedings

    MRS Proceedings 1642 2014-01-01

    Springer Science and Business Media LLC

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