Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
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- FUKUSHIMA Takafumi
- 東北大学
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- TANAKA Testu
- 東北大学
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- KOYANAGI Mitsumasa
- 東北大学
Bibliographic Information
- Title
- Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
- Author
- Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Journal
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- Micromachines
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Micromachines Vol.2 49-68, 2010
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Details 詳細情報について
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- CRID
- 1010000782064225303
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- Article Type
- journal article
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- Data Source
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- KAKEN