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Reflow behavior of Cu-Mn in LSI line patterns
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- ANDO Daisuke
- 東北大学
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- SUTOU Yuji
- 東北大学
Bibliographic Information
- Title
- Reflow behavior of Cu-Mn in LSI line patterns
- Author
- Tomohiro Saito, Daisuke Ando, Yuji Sutou, and Junichi Koike
Journal
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 53 2014
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Details 詳細情報について
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- CRID
- 1010000782103912323
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- Article Type
- journal article
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- Data Source
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- KAKEN