Thermal Displacement and Strain Fields Measurement of Electronic Package, Stacked-MCP, by Phase-Shifting Moire Interferometry using Wedged Glass Plate
Bibliographic Information
- Title
- Thermal Displacement and Strain Fields Measurement of Electronic Package, Stacked-MCP, by Phase-Shifting Moire Interferometry using Wedged Glass Plate
- Author
- Y.Morita, K.Arakawa, M.Todo
Journal
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- Transactions of the Japan Society of Instrument and Control Engineers 41-8
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Transactions of the Japan Society of Instrument and Control Engineers 41-8 625-629, 2005
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Details 詳細情報について
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- CRID
- 1010282256781883280
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- Article Type
- journal article
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- Data Source
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- KAKEN