A Study of the Reliability of MOSFETs in Two Stacked Thin Chips for 3D System in Package
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- 池田 晃裕
- Kyushu University
Bibliographic Information
- Title
- A Study of the Reliability of MOSFETs in Two Stacked Thin Chips for 3D System in Package
- Author
- Akihiro Ikeda, et al.
Journal
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- Proc. IEEE 43rd International Reliability Physics Symposium
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Proc. IEEE 43rd International Reliability Physics Symposium 578-579, 2005
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Details 詳細情報について
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- CRID
- 1010282256927621509
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- Article Type
- journal article
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- Data Source
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- KAKEN