Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium

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Bibliographic Information

Title
"Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium"
Statement of Responsibility
editor, G.S. Mathad ; assistant editors, H.S. Rathore ... [et al.] ; [cosponsored by] Dielectric Science & Technology, Electronics, and Electrodeposition Divisions [of the Electrochemical Society]
Publisher
  • Electrochemical Society
Publication Year
  • c2001-2003
Book size
24 cm
Series Name / No
  • [I]
  • II

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Notes

[I]:"The symposium, cosponsored by Dielectric Science & Technology, Electronics, and Electrodeposition Divisions, was held as part of the 198th meeting of The Electrochemical Society, Inc. in Phoenix, AZ, October 22-27, 2000"--on pref.

II:"..., was held as part of the 204th meeting of The Electrochemical Society, Inc. in Orlando, FL, October 12-17, 2003"--on pref

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