Microvias : for low cost, high density interconnects
CiNii
Available at 2 libraries
Bibliographic Information
- Title
- "Microvias : for low cost, high density interconnects"
- Statement of Responsibility
- John H. Lau , S.W. Ricky Lee
- Publisher
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- McGraw-Hill
- Publication Year
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- c2001
- Book size
- 24 cm
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Notes
Includes bibliographical references and index
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Details 詳細情報について
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- CRID
- 1130000794131789184
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- NII Book ID
- BA5821369X
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- ISBN
- 0071363270
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- New York
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- Classification
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- DC21: 621.381531
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- Subject
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- LCSH: Printed circuits
- LCSH: Miniature electronic equipment
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- Data Source
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- CiNii Books