CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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Bibliographic Information

Title
"CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas"
Statement of Responsibility
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1997
Book size
28 cm

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Notes

Includes bibliographical references and index

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