Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA

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Bibliographic Information

Title
"Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA"
Statement of Responsibility
[editors, G. S. Mathad ... [et al.]]
Publisher
  • Electrochemical Society
Publication Year
  • c2006
Book size
24 cm

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Notes

"Sponsoring Divisions: Dielectric Science and Technology, Electronics and Photonics, Electrodeposition."

Includes bibliographical references and indexes

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