Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

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Bibliographic Information

Title
"Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California"
Statement of Responsibility
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1998
Book size
28 cm
Other Title
  • Characterization of evolving packaging materials and structures
  • Evolving packaging materials and structures
  • Packaging materials and structures

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Notes

"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword

Includes bibliographical references and author index

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