Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials

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Bibliographic Information

Title
"Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials"
Statement of Responsibility
edited by T.O. Herndon, H.S. Rathore ... [et al.] ; [sponsored by the] Dielectric Sicence and Technology and Electronics Divisions
Publisher
  • Electrochemical Society
Publication Year
  • c1993
Book size
23 cm

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Notes

Includes bibliographical references and indexes

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Details 詳細情報について

  • CRID
    1130000795563259008
  • NII Book ID
    BA21695367
  • ISBN
    156677067X
  • LCCN
    93070069
  • Web Site
    https://lccn.loc.gov/93070069
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Pennington, NJ
  • Data Source
    • CiNii Books
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