Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado
Bibliographic Information
- Title
- "Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado"
- Statement of Responsibility
- sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association
- Publisher
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- International Society for Hybrid Microelectronics
- International Electronics Packaging Society
- Publication Year
-
- c1993
- Book size
- 28 cm
- Other Title
-
- 1993 proceedings : International Conference and Exhibition on Multichip Modules
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Notes
Papers from the Second International Conference and Exhibition on Multichip Modules
Includes bibliographical references
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Details 詳細情報について
-
- CRID
- 1130000795673615232
-
- NII Book ID
- BA27170184
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- ISBN
- 0930815378
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- LCCN
- 94101200
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- Web Site
- https://lccn.loc.gov/94101200
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- Text Lang
- en
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- Country Code
- us
-
- Title Language Code
- en
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- Place of Publication
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- Reston, Va.
- Wheaton, Ill.
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- Classification
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- LCC: TK7870.15
- DC20: 621.381/046
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- Data Source
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- CiNii Books