Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado

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書誌事項

タイトル
"Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado"
責任表示
sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association
出版者
  • International Society for Hybrid Microelectronics
  • International Electronics Packaging Society
出版年月
  • c1993
書籍サイズ
28 cm
タイトル別名
  • 1993 proceedings : International Conference and Exhibition on Multichip Modules

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注記

Papers from the Second International Conference and Exhibition on Multichip Modules

Includes bibliographical references

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