Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
Bibliographic Information
- Title
- "Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium"
- Statement of Responsibility
- editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition
- Publisher
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- Electrochemical Society
- Publication Year
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- c2003
- Book size
- 24 cm
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Notes
"... was held as part of the 202nd Meeting of the Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--on pref
Includes bibliographical references and indexes
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Details 詳細情報について
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- CRID
- 1130000795701430656
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- NII Book ID
- BA62538202
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- ISBN
- 1566773792
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- LCCN
- 2003103319
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- Web Site
- https://lccn.loc.gov/2003103319
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Pennington, N.J.
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- Data Source
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- CiNii Books