Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

Web Site CiNii Available at 1 libraries

Bibliographic Information

Title
"Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium"
Statement of Responsibility
editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition
Publisher
  • Electrochemical Society
Publication Year
  • c2003
Book size
24 cm

Search this Book/Journal

Notes

"... was held as part of the 202nd Meeting of the Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--on pref

Includes bibliographical references and indexes

Related Books

See more

Details 詳細情報について

  • CRID
    1130000795701430656
  • NII Book ID
    BA62538202
  • ISBN
    1566773792
  • LCCN
    2003103319
  • Web Site
    https://lccn.loc.gov/2003103319
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Pennington, N.J.
  • Data Source
    • CiNii Books
Back to top