Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications

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Bibliographic Information

Title
"Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications"
Statement of Responsibility
organizers/editors, C.E. Hunt ... [et al.]
Publisher
  • Electrochemical Society
Publication Year
  • c1995
Book size
23 cm

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Notes

"The Third International Symposium on Wafer Bonding was held at Reno in Spring, 1995"--Preface

Includes bibliographical references and index

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