Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications
Bibliographic Information
- Title
- "Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications"
- Statement of Responsibility
- organizers/editors, C.E. Hunt ... [et al.]
- Publisher
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- Electrochemical Society
- Publication Year
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- c1995
- Book size
- 23 cm
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Notes
"The Third International Symposium on Wafer Bonding was held at Reno in Spring, 1995"--Preface
Includes bibliographical references and index
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Details 詳細情報について
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- CRID
- 1130000795939046272
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- NII Book ID
- BA27991114
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- ISBN
- 1566771013
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- LCCN
- 95060442
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- Web Site
- https://lccn.loc.gov/95060442
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Pennington, NJ
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- Classification
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- LCC: TK7871.85
- DC20: 621.3815/2
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- Subject
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- Data Source
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- CiNii Books