Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Bibliographic Information
- Title
- "Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing"
- Statement of Responsibility
- editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
- Publisher
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- Electrochemical Society
- Publication Year
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- c1998
- Book size
- 23 cm
- Other Title
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- Chemical mechanical planarization in integrated circuit device manufacturing
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Notes
"Electronics and Dielectric Science and Technology Divisions."
"This volume contains most of the papers presented at the Second International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 193rd Annual Meeting of Electrochemical Society in San Diego during May 5-7, 1998."
Includes bibliographical references and indexes
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Details 詳細情報について
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- CRID
- 1130000796465148544
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- NII Book ID
- BA4328413X
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- ISBN
- 156677201X
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- LCCN
- 99196375
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- Web Site
- https://lccn.loc.gov/99196375
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Pennington, N. J.
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- Subject
-
- Data Source
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- CiNii Books