Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

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書誌事項

タイトル
"Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California"
責任表示
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling
出版者
  • American Society of Mechanical Engineers
出版年月
  • c1995
書籍サイズ
28 cm

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注記

Includes bibliographical references and index

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