Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Suhir, Ephraim

Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

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タイトル: "Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France"

責任表示: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

出版者

The American Society of Mechanical Engineers

出版年月

c1998

書籍サイズ: 28 cm

シリーズ名/番号

: pbk

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注記

Includes bibliographical references and index

"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, International Microelectronics and Packaging Society(IMAPS), Society of Plastics Engineering(SPE), The Association française de mecanique(AFM)

Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

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Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

書誌事項

この図書・雑誌をさがす

注記

関連図書・雑誌

詳細情報 詳細情報について

書き出し

詳細情報詳細情報について