Microelectronic interconnects and packages, system and process integration

Name: Microelectronic interconnects and packages, system and process integration
Author: Tewksbury, Stuart K., Carruthers, John R., DeFonzo, Alfred P., International Symposium on Advances in Interconnection and Packaging, Society of Photo-optical Instrumentation Engineers, IEEE Components, Hybrids, and Manufacturing Technology Society, IEEE Computer Society

Tewksbury, Stuart K., Carruthers, John R., DeFonzo, Alfred P., International Symposium on Advances in Interconnection and Packaging, Society of Photo-optical Instrumentation Engineers, IEEE Components, Hybrids, and Manufacturing Technology Society, IEEE Computer Society

Microelectronic interconnects and packages, system and process integration

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タイトル: "Microelectronic interconnects and packages, system and process integration"

責任表示: Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering, cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE

出版者

SPIE

出版年月

c1991

書籍サイズ: 28 cm

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Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, Boston, Mass.

Includes bibliographical references and index

Microelectronic interconnects and packages, system and process integration

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