Bibliographic Information
- Title
- "Wafer bonding : applications and technology"
- Statement of Responsibility
- M. Alexe, U. Gösele (eds.)
- Publisher
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- Springer-Verlag
- Publication Year
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- 2004
- Book size
- 24 cm
- Series Name / No
-
- : alk. paper
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Details 詳細情報について
-
- CRID
- 1130282269194782976
-
- NII Book ID
- BA68071671
-
- ISBN
- 3540210490
-
- LCCN
- 2004046626
-
- Web Site
- https://lccn.loc.gov/2004046626
-
- Text Lang
- en
-
- Country Code
- gw
-
- Title Language Code
- en
-
- Place of Publication
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- Berlin ; New York
-
- Classification
-
- LCC: TK7871.85
- DC22: 621.3815/2
-
- Subject
-
- LCSH: Semiconductors -- Bonding
- LCSH: Semiconductor wafers
-
- Data Source
-
- CiNii Books