Fatigue life prediction of solder joints in electronic packages with ANSYS

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Bibliographic Information

Title
"Fatigue life prediction of solder joints in electronic packages with ANSYS"
Statement of Responsibility
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
Publisher
  • Kluwer Academic
Publication Year
  • c2003
Book size
25 cm.

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Notes

CD-ROM in pocket attached to inside back cover

Includes bibliographical references and index

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