Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

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Bibliographic Information

Title
"Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida"
Statement of Responsibility
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c2000
Book size
28 cm

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Notes

Includes bibliographic references and author index

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