Materials in microelectronic and optoelectronic packaging

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Bibliographic Information

Title
"Materials in microelectronic and optoelectronic packaging"
Statement of Responsibility
edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla
Publisher
  • American Ceramic Society
Publication Year
  • c1993
Book size
24 cm

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Notes

"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso

Includes bibliographical references and index

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