Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

Web Site CiNii Available at 1 libraries

Bibliographic Information

Title: "Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993"

Statement of Responsibility: sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen

Publisher

Publication Year

Back to top