Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications

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Bibliographic Information

Title
"Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications"
Statement of Responsibility
editors, Ulrich Gösele ... [et al.] ; Electronics Division [of the Electrochemical Society]
Publisher
  • Electrochemical Society
Publication Year
  • c1998
Book size
23 cm
Other Title
  • Semiconductor wafer bonding : science, technology, and applications IV

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Notes

"The Fourth International Symposium on Wafer Bonding [was] held at Paris [France] in summer 1997 ... "--Preface

Includes bibliographical references and indexes

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