Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages
Bibliographic Information
- Title
- "Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages"
- Statement of Responsibility
- P.-E. Tegehall, B.D. Dunn
- Publisher
-
- ESA Publications Division
- Publication Year
-
- c2003
- Book size
- 30 cm
Search this Book/Journal
Notes
"March 2003."
Includes bibliographical references
- Tweet
Details 詳細情報について
-
- CRID
- 1130862534238494626
-
- NII Book ID
- BD06105390
-
- ISBN
- 9290923628
-
- LCCN
- 2003504225
-
- Web Site
- https://lccn.loc.gov/2003504225
-
- Text Lang
- en
-
- Country Code
- ne
-
- Title Language Code
- en
-
- Place of Publication
-
- Noordwijk
-
- Classification
-
- LCC: TK7870.16
-
- Subject
-
- Data Source
-
- CiNii Books