Damage Analysis of n-GaN Crystal Etched with He and N<sub>2</sub> Plasmas

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<jats:p> To understand the details of etching-induced damage on a GaN surface, n-GaN crystals were plasma-etched with He and N<jats:sub>2</jats:sub> gases. The etched surfaces were analyzed by X-ray photoelectron spectroscopy (XPS) and soft X-ray absorption spectroscopy (XAS) methods. The composition of the surface etched with He plasma changed significantly to being Ga-rich with the N/Ga ratio nearly equaling 0.4–0.5. The ratio of the surface etched with N<jats:sub>2</jats:sub> plasma was about 0.6. The shape of the near-edge X-ray absorption fine structure (NEXAFS) of the N-K edge deformed with increasing gas pressure and processing time. The deformation can be explained by the increase in the band widths of a number of peaks in the NEXAFS spectra owing to the increase in the degree of structural disorder in the crystal. The increase in band width for the surface etched with N<jats:sub>2</jats:sub> plasma was larger than that for the surface etched with He plasma. The above results can be explained with the model of the elastic energy transfer ratio of He<jats:sup>+</jats:sup> and N<jats:sub>2</jats:sub> <jats:sup>+</jats:sup> ions incident on the solid surface. </jats:p>

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