Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

DOI PDF 2 Citations

Journal

2008 58th Electronic Components and Technology Conference

2008 58th Electronic Components and Technology Conference 2008-05

IEEE

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Details 詳細情報について

CRID

1360013337583294336
DOI

10.1109/ectc.2008.4550071
Web Site

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550071.pdf?arnumber=4550071
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