Recent Advances and Trends in Advanced Packaging
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- John H. Lau
- Unimicron Technology Corporation, Taoyuan, Taiwan
Journal
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- IEEE Transactions on Components, Packaging and Manufacturing Technology
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IEEE Transactions on Components, Packaging and Manufacturing Technology 12 (2), 228-252, 2022-02
Institute of Electrical and Electronics Engineers (IEEE)
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Details 詳細情報について
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- CRID
- 1360298341436388864
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- ISSN
- 21563985
- 21563950
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- Data Source
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- Crossref