Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy
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- Norio Chujo
- Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan
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- Koji Sakui
- Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan
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- Shinji Sugatani
- Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan
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- Hiroyuki Ryoson
- Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan
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- Tomoji Nakamura
- Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan
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- Takayuki Ohba
- Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan
Journal
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- 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 2023-06-11
IEEE