Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications
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- Zihao Mo
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Fangcheng Wang
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Jinhui Li
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Qiang Liu
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Guoping Zhang
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Weimin Li
- Centre for Photonics Information and Energy Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Chunlei Yang
- Centre for Photonics Information and Energy Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
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- Rong Sun
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
説明
<jats:p>Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.</jats:p>
収録刊行物
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- Electronics
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Electronics 12 (7), 1666-, 2023-03-31
MDPI AG
