RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

DOI Web Site Web Site 3 Citations

Journal

Microelectronic Engineering

Microelectronic Engineering 87 (3), 491-495, 2010-03

Elsevier BV

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CRID

1360855568857302912
DOI

10.1016/j.mee.2009.08.026
ISSN

01679317
Web Site

https://api.elsevier.com/content/article/PII:S0167931709005620?httpAccept=text/xml

https://api.elsevier.com/content/article/PII:S0167931709005620?httpAccept=text/plain
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