Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

DOI PDF 1 Citations

Journal

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016 869-876, 2016-05

IEEE

Citations (1)*help

See more

Details 詳細情報について

CRID

1360855569920834816
DOI

10.1109/ectc.2016.202
Web Site

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545530.pdf?arnumber=7545530
Data Source
- Crossref

Export

Report a problem

Back to top