Ultra thinning down to 4-µm using 300-mm wafer proven by 40-nm node 2Gb DRAM for 3D multi-stack WOW applications

Journal

• 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers

  2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers 2014-06

  IEEE