Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis

DOI PDF 1 Citations

Journal

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 297-, 2014-05

IEEE

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Details 詳細情報について

CRID

1361137046239709952
DOI

10.1109/ectc.2014.6897302
Web Site

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897302.pdf?arnumber=6897302
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