Pores and Ridges: High-Resolution Fingerprint Matching Using Level 3 Features

DOI PDF 2 Citations

Journal

IEEE Transactions on Pattern Analysis and Machine Intelligence

IEEE Transactions on Pattern Analysis and Machine Intelligence 29 (1), 15-27, 2007-01

Institute of Electrical and Electronics Engineers (IEEE)

Citations (2)*help

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Details 詳細情報について

CRID

1362262943563377152
DOI

10.1109/tpami.2007.250596
ISSN

21609292

01628828
Web Site

http://xplorestaging.ieee.org/ielx5/34/4016543/04016547.pdf?arnumber=4016547
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- Crossref

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