Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
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- Yingqiong Yong
- Division of Materials Science and Engineering
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- Mai Thanh Nguyen
- Division of Materials Science and Engineering
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- Tetsu Yonezawa
- Division of Materials Science and Engineering
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- Takashi Asano
- Division of Materials Science and Engineering
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- Masaki Matsubara
- Division of Materials Science and Engineering
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- Hiroki Tsukamoto
- Division of Materials Science and Engineering
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- Ying-Chih Liao
- Division of Materials Science and Engineering
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- Tengfei Zhang
- Division of Materials Science and Engineering
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- Shigehito Isobe
- Division of Materials Science and Engineering
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- Yuki Nakagawa
- Division of Materials Science and Engineering
書誌事項
- 公開日
- 2017
- DOI
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- 10.1039/c6tc04360g
- 公開者
- Royal Society of Chemistry (RSC)
この論文をさがす
説明
<p>Decomposable polymer was used for low temperature sintering of Cu fine particles for conductive films.</p>
収録刊行物
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- Journal of Materials Chemistry C
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Journal of Materials Chemistry C 5 (5), 1033-1041, 2017
Royal Society of Chemistry (RSC)
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キーワード
詳細情報 詳細情報について
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- CRID
- 1362544420106450688
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- ISSN
- 20507534
- 20507526
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- HANDLE
- 2115/65126
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- データソース種別
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- Crossref
- OpenAIRE