- 【Updated on May 12, 2025】 Integration of CiNii Dissertations and CiNii Books into CiNii Research
- Trial version of CiNii Research Knowledge Graph Search feature is available on CiNii Labs
- 【Updated on June 30, 2025】Suspension and deletion of data provided by Nikkei BP
- Regarding the recording of “Research Data” and “Evidence Data”
Double-sided cooling for high power IGBT modules using flip chip technology
Search this article
Journal
-
- IEEE Transactions on Components and Packaging Technologies
-
IEEE Transactions on Components and Packaging Technologies 24 (4), 698-704, 2001
Institute of Electrical and Electronics Engineers (IEEE)
- Tweet
Details 詳細情報について
-
- CRID
- 1363107370108062080
-
- ISSN
- 15213331
-
- Data Source
-
- Crossref