Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns
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- Kuan-Ming Huang
- Department of Chemical Engineering
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- Hiroki Tsukamoto
- Division of Materials Science and Engineering
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- Yingqiong Yong
- Division of Materials Science and Engineering
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- Hsien-Lung Chiu
- Department of Chemical Engineering
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- Mai Thanh Nguyen
- Division of Materials Science and Engineering
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- Tetsu Yonezawa
- Division of Materials Science and Engineering
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- Ying-Chih Liao
- Department of Chemical Engineering
書誌事項
- 公開日
- 2017
- DOI
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- 10.1039/c7ra01005b
- 公開者
- Royal Society of Chemistry (RSC)
説明
<p> An alkylamine is added to stabilize the thermal decomposition process and to improve the surface morphology of printed patterns. The adhesion and mechanical stability of the copper thin films are also investigated.</p>
収録刊行物
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- RSC Advances
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RSC Advances 7 (40), 25095-25100, 2017
Royal Society of Chemistry (RSC)
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詳細情報 詳細情報について
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- CRID
- 1363670320074556928
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- ISSN
- 20462069
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- HANDLE
- 2115/66403
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- データソース種別
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- Crossref
- OpenAIRE
