Copper hydride formation in the electroless copper plating process: in situ X-ray diffraction evidence and electrochemical study

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Journal

Electrochimica Acta

Electrochimica Acta 43 (9), 1061-1066, 1998-04

Elsevier BV

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CRID

1363670320770841856
DOI

10.1016/s0013-4686(97)00282-x
ISSN

00134686
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https://api.elsevier.com/content/article/PII:S001346869700282X?httpAccept=text/xml

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