Copper hydride formation in the electroless copper plating process: in situ X-ray diffraction evidence and electrochemical study

詳細情報 詳細情報について

• CRID

  1363670320770841856

• DOI

  10.1016/s0013-4686(97)00282-x

• ISSN

  00134686

• Web Site

  https://api.elsevier.com/content/article/PII:S001346869700282X?httpAccept=text/xml

  https://api.elsevier.com/content/article/PII:S001346869700282X?httpAccept=text/plain

• データソース種別

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