Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Details 詳細情報について

• CRID

  1364233270750953728

• DOI

  10.1016/j.actamat.2006.12.019

• ISSN

  13596454

• Web Site

  https://api.elsevier.com/content/article/PII:S1359645407000250?httpAccept=text/xml

  https://api.elsevier.com/content/article/PII:S1359645407000250?httpAccept=text/plain

• Data Source

  • Crossref