Research of Reconstructed Wafer Surface Planarity on the Metall-Compound-Silicon Boundary for Multi-Chip Module with Embedded Dies
収録刊行物
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- 2019 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus)
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2019 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus) 2008-2012, 2019-01
IEEE