Void-induced thermal impedance in power semiconductor modules: Some transient temperature effects

DOI PDF 1 Citations

Journal

IEEE Transactions on Industry Applications

IEEE Transactions on Industry Applications 39 (5), 1239-1246, 2003-09

Institute of Electrical and Electronics Engineers (IEEE)

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Details 詳細情報について

CRID

1364233271273507840
DOI

10.1109/tia.2003.816527
ISSN

00939994
Web Site

http://xplorestaging.ieee.org/ielx5/28/27640/01233581.pdf?arnumber=1233581
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