Effects of magnetic field on operation in planar magnetron sputtering.
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- FUKAMI Tatsuo
- Fac. of Eng., Shinshu Univ.
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- SHINTANI Fumihiko
- Fac. of Eng., Shinshu Univ.
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- NAOE Masahiko
- Fac. of Eng., Tokyo Institute of Technology
Bibliographic Information
- Other Title
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- 平板マグネトロンスパッタの動作に及ぼす磁界の影響
Description
Discharge characteristics in planar magnetron sputtering systems have been studied through target erosion patterns. The erosion pattern was affected not only by magnetic flux distribution but also by discharge power and sputtering gas pressure. A model analysis revealed that this behavior was due to interaction between the vertical component of the field and electrons moving in a transverse direction. A definite correlation with the pattern was found, indicating that the transition in the discharge characteristic from magnetron mode to high impedance mode was brought about by the escape of trapped electrons from the target edge.
Journal
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- Journal of the Metal Finishing Society of Japan
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Journal of the Metal Finishing Society of Japan 37 (6), 308-312, 1986
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204111254656
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- NII Article ID
- 130003994714
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- ISSN
- 18843395
- 00260614
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed