書誌事項
- タイトル別名
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- Fabrication of Ultra-large Scale Integrated by Electroless Neutral Copper Plating.
- チュウセイ ムデンカイ ドウメッキ ニ ヨル ULSI ドウ ハイセン ノ ケイセイ
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説明
Copper promises to replace aluminum in ULSI metallization thanks to its better conductivity and reliability. ULSI metallization is formed by electroless neutral copper plating using cobalt (II) compound as a reducing agent. Results show good storage stability, and trenches/holes on silicon wafers are filled by copper deposits. Hydrogen gas did not evolved in the plating reaction, and not effect from alkaline metal ions was seen. This process may thus be applied to ULSI matallization, using electroless neutral plating with cobalt (II) compound as a reducing agent.
収録刊行物
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- 表面技術
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表面技術 50 (4), 374-377, 1999
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390001204115703808
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- NII論文ID
- 10002112228
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- NII書誌ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK1MXisVCrtb0%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL書誌ID
- 4707974
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用不可