Influence of Electroless Ni-P Film Condition on Wire Bondability
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- KATO Ikuhiro
- Graduate School of Engineering, Kanto Gakuin University
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- TERASHIMA Hajime
- Kojima Chemicals Co., Ltd.
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- WATANABE Hideto
- Kojima Chemicals Co., Ltd.
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- HONMA Hideo
- Faculty of Engineering, Kanto Gakuin University
Bibliographic Information
- Other Title
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- 下地無電解ニッケル‐リン皮膜状態がワイヤーボンディング特性に与える影響
- 下地無電解ニッケル-リン皮膜状態がワイヤーボンディング特性に与える影響
- シタジ ムデンカイ ニッケル リン ヒマク ジョウタイ ガ ワイヤーボンディング トクセイ ニ アタエル エイキョウ
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Abstract
With increasing thickness of electroless gold films (greater than 0.5 μm) as a top layer, Au/Ni film shows good wire bondability. However, we confirmed that the deposited nickel structure influences wire bondability for thinner (less than 0.5 μm) electroless gold plating after heat treatment because of the different diffusion behavior of gold on the deposited nickel used as an underlayer. In this study, two types of electroless nickel plating structure with columnar and layered structure were observed and bondability was evaluated. Auto-catalytic gold of 0.2 μm thickness on the layered nickel deposits shows good wire bondability after heat treatment because the gold was deposited uniformly. In contrast, for a columnar structure, the gold on the Ni films shows poor wire bondability after heat treatment because of local corrosion occurring at the initial stage of gold immersion and because the subsequent auto-catalytic gold is not evenly distributed.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 62 (1), 47-53, 2011
The Surface Finishing Society of Japan
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Keywords
Details 詳細情報について
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- CRID
- 1390001204118141696
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- NII Article ID
- 10027756456
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BC3MXhvFOnsr4%3D
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 10957390
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed