Analysis of Adhesion Property of Photoresist Micro Pattern by Scanning Method of Micro Tip with Atomic Force Micro scope

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  • KAWAI Akira
    Department of Electrical Engineering, Nagaoka University of Technology
  • KAWAKAMI Yoshiaki
    Department of Electrical Engineering, Nagaoka University of Technology

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  • 原子間力顕微鏡 (AFM) を用いた微細探針走査法による フォトレジスト微細パターンの接着性解析
  • ゲンシカンリョク ケンビキョウ AFM オ モチイタ ビサイタンシン ソウサホウ ニ ヨル フォトレジスト ビサイ パターン ノ セッチャクセイ カイセキ

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Abstract

By using an atomic force microscope (AFM), we discuss validity of analysis method of adhesion and cohesion property of micro photoresist pattern. Dot shaped photoresist patterns, 0.60μm in square and 1.01μm in height were formed onto a flat substrate by photolithography. Load for collapse of photoresist pattern and its deflection are measured by applying load with an AFM micro tip. By combining with stress and deformation analysis by finite element method, internal stress for collapse and Young's modulus of the photoresist pattern can be obtained. These value increase with heating temperature of photoresist pattern. By the thermal analysis of weight loss, hardness and refractiveindex, we confirmed the validity of this method. This method can be applied to adhesion and cohesion analysis of micro condensed matter adhered on a flat substrate.

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